A technology forming a micro via hole is applied using a laser drill under the process
of forming multi-layers while PCBs are successively laminated

◎ Usage
portable electronic devices (Cellular phones, DMB, PCM cards)

◎ Specification
up to ten layers
Thickness of board : 0.6 ~ 1.2mm
Width/interval of Patterns : 100㎛  / 100㎛
Smallest hole size : 0.15mm (laser drill)